| 摘要 |
PURPOSE:To radiate any heat generated by semiconductor parts by a method wherein a cooling module such as a heat sink is mounted on semiconductor parts actually face-down bonded on a substrate through or not through the intermediary of insulating plates with excellent heat conductivity. CONSTITUTION:Spacers 4 are preliminarily bonded to the specified positions on the surface of substrate 1 and then semiconductor parts 5 are also face-down bonded on each spacer to be actually mounted while lead wires 6 led out of each terminal part of said semiconductor parts 5 are connected to each lead terminal 2 on the substrate 1. Besides, a cooling module 8 such as a heat sink is mounted on each semiconductor part 5 through the intermediary of insulating plates 7 made of SiC, BeO, etc. with excellent conductivity. Through these procedures, any heat generated by each conductor part can be radiated directly from the cooling module 8. |
