| 摘要 |
PURPOSE:To accelerate a bonding speed by providing an inverting drive unit for rotating a die supply unit to an X-Y table in a horizontal plane at 180 deg., and a bonding head for picking up each die diced from a semiconductor wafer one by one. CONSTITUTION:An X-Y table 10 is moved to accurately bring a die directly under a bonding head 1 to pick up dies from a wafer 8 one by one, and the head 1 picks up the wafer 8 in a pickup range. After finishing the pickup, an inverting drive unit 9 turns by half in a horizontal plane to accurately turn by half a die supply unit 5 at 180 deg. to move the die of the range where cannot pickup before turning the table 10 to a range capable of picking up the die, and the head 1 again picks up the die of the remaining half range. Thus, even if a large bore wafer is used for production, the wafer can be bonded by the head moving distance of radius of the wafer to countermeasure the increase in the bore of the wafer and to largely shorten the assembling time. |
