| 摘要 |
PURPOSE:To obtain a high-reliable hermetic seal cover by a method wherein a seal ring manufactured of a low melting point alloy solder material mainly consisting of lead, tin, indium, etc. is joined extending over the whole circumference to the circumferential part of the cover manufactured of a metal having a film having favorable solderability at least on the said circumferential part to come in contact with the seal ring. CONSTITUTION:This device consists of a heat block 9 with a built-in heater 8 and a pressurizing member 10, and a recess enabling a cover 6 to be inserted therein and a vent hole 11 to introduce neutral gas or reducing gas into the said recess are provided to the said heat block 9. The cover 6 is put in the said recess heating the heat block 9 at the prescribed temperature, and flowing nonoxidizing gas therein, a seal ring 5 is put on the cover 6 as to make the circumferences thereof to nearly coincide, and a press board 12 consisting of a material hardly to be adhered with a solder material such as stainless steel, ceramics or Teflon is put on the seal ring 5. When the device constructed in such a way is pressed for the prescribed hours by means of the above-mentioned pressurizing member 10, the seal ring 5 is joined to the cover 6, and the cover having high reliability in regard to seal can be obtained. |
