发明名称 |
INLINE TYPE THIN FILM FORMING DEVICE |
摘要 |
PURPOSE:To provide a titled device which decreases a loss time by cleaning and to improves throughput by providing successively and adjacently a substrate charging chamber, a deposition chamber for forming a thin film on a substrate and a substrate taking out chamber. CONSTITUTION:This inline type thin film forming device is constituted by providing successively and adjacently the substrate charging chamber 1, the deposition chamber 2 provided with a sputtering electrode 7 carrying a target 6 which is a vapor deposition source for depositing the thin film on the substrate and the substrate taking out chamber 3. An antisticking plate 8 to be disposed in the chamber 2 so as to cover the target 6, etc. of the above-mentioned device is provided conveyably by a suitable conveying means to the chambers 1-3. The clean plate 8 is carried from the chamber 1 through a valve 4 into the chamber 2 to prevent the sticking of the material for deposition on the wall surface. The plate 8 is taken out through the chamber 3 in the stage of cleaning the plate so that the loss time by the cleaning is decreased.
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申请公布号 |
JPS61210177(A) |
申请公布日期 |
1986.09.18 |
申请号 |
JP19850050508 |
申请日期 |
1985.03.15 |
申请人 |
HITACHI LTD;HITACHI MICRO COMPUT ENG LTD |
发明人 |
OBARA TAKASHI;NOZAWA HISAO;NISHIDA HIDEKI;EDA AKIRA |
分类号 |
H01L21/677;C23C14/56;H01L21/02;H01L21/203;H01L21/31 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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