| 摘要 |
PURPOSE:To obtain a semiconductor device, in which wires are bonded excellently and contacts among the wires can be prevented and whose package can be miniaturized, by forming stepped sections to a substrate so that each of bonding sections with the wires in the substrate mutually has the difference in its height. CONSTITUTION:A semiconductor chip 5 is die-bonded into a recess 2 in a substrate 1 by a joining material 6, and a plurality of chip-side bonding pads 7 disposed to the four sides of the chip 5 and head sections 8 in lead pins 9, one parts thereof are buried into the substrate 1 made of a resin, the head sections 8 thereof are exposed from said bonding sections 3, 4 for the substrate 1 and which are projected in the vertical direction from the back of the substrate 1, are wire-bonded by wires 10. Since stepped sections are formed to the bonding sections 3, 4 with several wire of the substrate 1, the wires 10 bonding the chip-side bonding pads 7 and the head sections 8 of the lead pins 9 in the bonding section 4 are positioned being higher than the wires 10 similarly bonding the chip-side bonding pads 7 and the head sections 8 of the lead pins 9 in the bonding section 3. |
