| 摘要 |
PURPOSE:To ensure the detection of position deviation in flip chip bonding by electric characteristic examination, by forming one or a plurality of dummy bumps in addition to inherent bonding bumps. CONSTITUTION:In addition to inherent bonding bumps 5, one ore a plurality of dummy bumps are formed. When the positions of a circuit substrate 2 and a semiconductor device 1 are deviated at the time of bonding, the two dummy bumps 3 and a dummy pattern 4, which is held by the bumps, are shorted. Therefore, faults can be detected by electric characteristic examination after mounting. |
