| 摘要 |
PURPOSE:To prevent the deformation and damage of a pellet and the like due to difference in thermal expansion coefficient of a wafer and a package substrate, by pushing the pellet to the package substrate by the elastic force of a fixing member, and holding the pellet. CONSTITUTION:A full wafer LSI5, which is attached to a wiring substrate 6, is held by an annular cap 11, which is attached to a package substrate 2 and its upper part. The cap 11 comprises a material having strong elastic force. The cap 11 fixed to the package substrate 2 by bolts 12 at a plurality of positions on the peripheral part. An edge part 13 is provided so as to face downward at the outermost edge of the cap. Meanwhile, a protruded part 14 is provided so as to face downward at the inner surface edge. Namely, the protruded part 14 elastically pushes the wiring substrate 6 and the full wafer LSI5 toward the bottom part of a cavity 3. Therefore, the wiring substrate 6 and the full wafer LSI5 are elastically held with respect to the package substrate 2 without using a bonding agent and the like. |
