发明名称 BONDING APPARATUS
摘要 PURPOSE:To suppress warping of a lead frame owing to heating, by forming each face of a heat block contacting with the lead frame in accordance with the shape of the lead frame centering the tab. CONSTITUTION:A plural (three in this example) of face sections 10 on a heat block 6 contacting with a lead frame 1 are projected at regular intervals longitudinally in accordance with array of tabs 2 in the lead frame 1. A planar shape of each contacting face section 10 is formed approximately in a + shape so that the heat block can contact only with tabs. Thus it can be prevented that heating the heat block may result in warping of the lead frame and the warping may result in error. Therefore, precision of the bonding can be improved.
申请公布号 JPS6197935(A) 申请公布日期 1986.05.16
申请号 JP19840218473 申请日期 1984.10.19
申请人 HITACHI LTD 发明人 OKAMOTO MICHIO
分类号 H01L21/60 主分类号 H01L21/60
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