| 摘要 |
Wave soldering machine for printed circuit boards, comprising a frame 10 onto which is mounted at least one solder pot 20 with a nozzle 21 via which a molten solder alloy flows in the form of a wave, a horizontal or slightly upwardly or downwardly sloping conveyor 22 mounted above the said solder pot, the said conveyor driving the said printed circuit boards whose faces, onto which the soldered joints are to be made, are oriented downwards, along a path such that the faces in question are lapped by the said wave, characterised in that the said conveyor 22 is mounted so as to pivot on the said machine about a pivot axis XX disposed laterally with respect to the said solder pot. <IMAGE>
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