VERFAHREN ZUR HERSTELLUNG VERFORMBARER VIELFACH-VERBINDUNGEN FUER DEN ELEKTRISCHEN ANSCHLUSS MIKROELEKTRONISCHER BAUELEMENTE UND NACH DIESEM VERFAHREN HERGESTELLTE VIELFACHVERBINDUNGEN

摘要

The invention is based on the object of producing multiple connections, which can be deformed within specific limits, for the electrical connection of micro-electronic components, which compensate for the most varied thermal expansion of the chip and substrate or other similarly constructed electronic components, which are to be connected to one another, with a space requirement that is as small as possible. The solution of this object is characterised in that a plate-type material, whose properties can be altered by high-energy radiation, is used to produce a plate-shaped mould by means of partial irradiation and partial removal of this material, while utilising the different material properties generated by the irradiation, the resulting form containing structures of connecting elements at predetermined positions, whose height is a multiple of their smallest lateral dimensions, in that the structures are galvanically filled with metal, the galvanically generated connecting elements are fixed on a substrate plate or on a retaining plate, and the mould is removed.