MOUNTING STRUCTURE OF ELECTRONIC PART LEADLESS PACKAGE,申请号JP19840186905-传众专利搜索

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发明名称	MOUNTING STRUCTURE OF ELECTRONIC PART LEADLESS PACKAGE
摘要
申请公布号	JPS6164186(A)	申请公布日期	1986.04.02
申请号	JP19840186905	申请日期	1984.09.06
申请人	MITSUBISHI ELECTRIC CORP	发明人	SAITO KENJI;FUKINO MASAHIRO
分类号	H05K1/18	主分类号	H05K1/18
代理机构		代理人
主权项
地址

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