Method for soldering printed-circuit boards

摘要

The invention relates to a method for soldering printed-circuit boards, in which, after being fitted with components, the printed-circuit boards pass through a plurality of stations in which they are successively subjected to a fluxing process, a pre-heating process, and the actual soldering process. According to the invention, after the actual soldering process, the printed-circuit boards are heated until existing tin-solder links are melted away. Subsequently, the underneath sides of the printed-circuit boards are scanned optically in order to identify soldering defects.