发明名称 LEAD CUT AND LEAD BENDING DEVICE OF HYBRID IC OR THE LIKE
摘要 PURPOSE:To enable a titled device to make cutting and bending work of a lead simultaneously by providing a rotation shaft on which a pallet is placed and rotatable in a vertical plane, a clamp plate that bends a work by a cylinder and an upper cutter that cooperates with a lower cutter. CONSTITUTION:After carrying a pallet 16 on which a hybrid IC 50 is placed in a parallel notched part of a rotation shaft 14 and positioning by a notch 17, a clamp plate 13 is lowered by a clamp cylinder to clamp a lead 52 of the IC 50 between the lower cutter 7. Then, a cutter cylinder is lowered, and the lead 52 is cut by the upper cutter fixed to the movable side 12 of a slide unit, and at the same time, the rotation shaft 14 is rotated by a specified angle and the lead 52 is bent by the back face 21 of the clamp plate 13. Thus, carrying out of cutting and bending works of a lead simultaneously automatically with high accuracy becomes possible.
申请公布号 JPS60166135(A) 申请公布日期 1985.08.29
申请号 JP19840021853 申请日期 1984.02.10
申请人 MITSUBISHI JUKOGYO KK 发明人 MANGETSU KENJI
分类号 H05K13/04;B21F1/00;B21F11/00;B23P21/00;H05K13/00 主分类号 H05K13/04
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