| 摘要 |
PURPOSE:To dissipate heat generated in each semiconductor chip rapidly to a coolant passing in a cooling body by pressure-welding a diaphragm forming one side wall of the cooling body to the surfaces of each semiconductor chip. CONSTITUTION:A plurality of semiconductor chips 2 are soldered to a conductor section for an insulating substrate 1 through solder bumps 3. A coolant 8 is circulated into a cooling body 10, one side wall of the cooling body 10 is formed by a thin diaphragm 11 having excellent thermal conductivity, and projecting sections 12 for absorbing heat are pressure-welded to the surfaces of the oppositely fitted semiconductor chips 2 by the pressure of the coolant 8. Accordingly, a hybrid integrated circuit having high performance and high density is obtained because heat generated from each semiconductor chip can be dissipated rapidly in a large quantity, and the whole can be miniaturized because the structure of the coolant is simple. |
