发明名称 ELECTROLYTIC STRIPPING METHOD OF PLATING DEPOSIT
摘要 PURPOSE:To remove surely the plating metal sticking on a rack for plating and to enable incorporation of a stripping stage into a plating line by stripping away the metal sticking on the rack in a stripping tank, removing the precipitate from the stripping liquid, replenishig the stripping liquid with the consumed component and returning the liquid into the stripping tank. CONSTITUTION:A rack for suspending a material to be plated is put into an electrolytic stripping tank 1 provided in the mid-way of a plating line in order to remove the metal sticking thereon during the plating treatment. The stripping liquid is supplied through a pipe 3 into a setting tank 2 having a partition plate 9 where the stripped metal is settled. The settled metal is returned from a clarifying chamber 11 through a return pipe 4 again into the tank 1. The stripping liquid in the tank 1 is replenished with the defficient component consumed by the stripping to maintain always the specified compsn. of said liquid so that the stripping effect is effectively continued. The stripped precipitate is removed from the bottom of the tank 2 and is filtered and separated by a filter device 12 such as a filter press. The filtrate is returned to the tank 2.
申请公布号 JPS59229500(A) 申请公布日期 1984.12.22
申请号 JP19830102386 申请日期 1983.06.08
申请人 SANWA BOUSEI KK 发明人 URAGAMI SUMIO
分类号 C25F5/00;(IPC1-7):C25F5/00 主分类号 C25F5/00
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