| 摘要 |
PURPOSE:A sealing agent for electronic materials, e.g. IC packages, containing an anionic exchange substance containing -OH bonds, and capable of capturing and fixing ionic substances dissolved from a sealing component and keeping stable and improved performance. CONSTITUTION:A sealing agent containing constituent components such as a low-melting glass, an epoxy resin, phenolic resin or silicone resin for fusion, fused silica or beta-eucryptite as a filler and preferably 1.5-25wt%, based on the total amount of the sealing agent, inorganic ion exchange substance, preferably antimonic acid, a salt thereof, zirconium phosphate, cerium phosphate, tin phosphate, titanium phosphate, hydrous bismuth oxide, hydrous manganese oxide or hydrous tin oxide, having -OH bonds.
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