| 摘要 |
PURPOSE:To prevent the invasion of water by a glass layer and to prevent aluminum pads from corroding due to pressure and moisture tests by covering at least the pads with the glass layer. CONSTITUTION:A semiconductor element chip 12 is bonded to a lead frame 11, and lead wirings are connected to a lead frame 11 via gold wirings 14 from aluminum pads 13 formed on the surface of the chip 12. Then, liquid glass made of Si(OH)2 is dropped, cured at 300 deg.C to form a glass layer 15 of SiO2, thereby sealing it with resin. |
