| 摘要 |
1,105,650. Laminates. GOODYEAR AEROSPACE CORPORATION. 14 July, 1966 [20 Sept., 1965], No. 31719/66. Heading B5N. [Also in Division H1] A printed circuit, comprising a plastics substrate 2 having on one surface Ni wiring 4 terminating in tabs 12. which are bent upward to protrude through holes 8 in the substrate 2, is made in the following way. The starting material-is a laminate comprising the preferably transparent substrate 2 clad on one side with a Cu layer and on the other side with a Ni layer; both metal layers are coated with photo-resist material and exposed and developed to produce, on the Ni layer a positive resist pattern of the desired wiring 4 including tabs 12, and on the Cu layer a negative resist pattern of the desired holes 8 in substrate 2. The Ni surface is protected, and the Cu layer is etched with ferric chloride to expose the substrate 2 where holes are desired; the holes 8 are then etched in substrate 2 with sulphuric acid, which also removes the resist from the Cu layer. The protection is removed from the resist-bearing Ni surface, which is then etched into the desired wiring pattern with ferric chloride, which also removes the remaining Cu layer. A photosensitive layer 18 is rolled on to the surface of the substrate opposite the Ni wiring, and is exposed and developed to provide a visual representation of components which are to be mounted on the printed circuit and other information. A fibreglass mesh 23 is laminated over the surface of the substrate bearing Ni wiring 4, and the tabs 12 are bent up through the holes 8 in the substrate, as by air pressure. To connect a component 28 to the circuit, a lead 29 of the component is passed through a hole 11 in a tab 12 and welded to the tab. |
