| 摘要 |
PURPOSE:To enable to continuously produce multikind parts of a small quantity as well as to reduce the percentage of rejects by a method wherein, after a lead frame has been pinched between forming materials and formed in one body with a composite tablet, an element is die-inner bonded on the molded article, and said element is sealed by performing a potting. CONSTITUTION:The upper and lower surfaces of a metal lead frame 1 are pinched with the forming material consisting of phenol resin, epoxy resin and the like, and after they are formed in one body with a composite table 6, they are formed by performing a compression molding. Subsequently, after an element 2 has been die-inner bonded on a molded article 7, the element 2 is sealed by performing a potting 9 using a casting material consisting of phenol resin, epoxy resin and the like, and a resin sealed type electronic part is obtained. In order to improve the adhesive property of the forming material and the casting material, an activating process such as a pretreatment, a coating process and the like may be performed on the surface of the element, where die-inner bonding was performed, and on the surface of the lead frame. |
