发明名称 |
HYBRID-INTEGRIERTE SCHALTUNG UND VERFAHREN ZUR HERSTELLUNG DERSELBEN |
摘要 |
<p>A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering.</p> |
申请公布号 |
DE3330068(A1) |
申请公布日期 |
1984.02.23 |
申请号 |
DE19833330068 |
申请日期 |
1983.08.19 |
申请人 |
DENKI KAGAKU KOGYO K.K. |
发明人 |
ASAI,SHINICHIRO;KATOH,KAZUO;NAKANO,TATSUO |
分类号 |
H05K3/06;H01L21/48;H01L21/60;H01L23/14;H01L25/16;H05K1/09;H05K3/24;(IPC1-7):05K3/32 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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