| 摘要 |
<p>1,213,691. Metal-rubber laminates. LORD CORP. 4 Jan., 1968 [26 Jan., 1967], No. 714/68. Heading B5N. [Also in Division C3] Natural and synthetic rubbers may be bonded to metal with a composition comprising dinitrosobenzen (DNB) and a silane wherein at least one R is a methoxy, ethoxy, propoxy or acetoxy group or a chlorine atom, and any remaining groups R are inert to hydrolysis. Preferably the composition contains 0À1 to 7À5 parts by weight of silane per part of DNB, and also contains up to 3 part per parts of DNB/silane mixture of a chlorinecontaining film-forming polymer, e.g. chlorosulphonated polyethylene, chlorinated polyethylene - propylene copolymers, chlorinated P.V.C., chlorinated polyethylene and chlorinated natural rubber. In addition the composition may contain, per p.b.w. of DNB/ silane mixture, 0À01 to 1À5 parts of a polyisocyanate, and/or 0À5 to 3 parts of an epoxidized novolak. Other conventional additives may be present e.g. C black and ZnO, as fillers, or hydrocarbon or halohydrocarbon or ketone diluents. In the examples compositions are prepared from DNB andγ-methacryloxypropyl trimethoxysilane in benzene or xylene alone (Examples 1-13) or with chlorinated polyethylene/propylene (60 : 40 by weight, containing 1-2 wt. per cent of cyclopentadiene) plus C black and ZnO, (Example 14) or with a chlorosulphonated polyethylene and dianisidine diisocyanate (DADI) (Examples 15 and 16) or with DADI and chlorosulphonated polyethylene, polychloroprene, chlorinated P.V.C., chlorinated polyethylene or chlorinated natural rubber or the resin 'of Example 14 (Examples 17-38). In Examples 39 and 41 DNB and silane is mixed with the terpolymer of Example 14 plus C black, an epoxy novolak and propylene dichloride/trichloroethylene, or with chlorosulphonated polyethylene, DADI, C black, ZnO, trichloroethylene and xylene. The compositions are used to bond natural rubber, polychloroprene, butadiene - acrylonitrile, butadiene-styrene and butyl rubber stocks to grit-blasted cold rolled steel. The rubber may be cured during bonding. A list of metals that may be bonded is given.</p> |
