| 摘要 |
<p>An intermediate layer contg. 0.1-5 (0.4-2)%, Mn, opt. other additives, e.g. 0.05-0.9% Mg, 0.05-0.8% Fe, 0.05-0.7% Si, 0.05-0.4% Cu, bal. Al, with unavoidable impurities, is provided between basic working material and soldering layer contg. 4-20% Si, 0.01-10 (0.05-2)% Bi and/or Sr and/or Ba and/or Sb, bal. Al. and unavoidable impurities, according to parent patent. Process is esp. suitable for fluxless soldering of high-strength Al alloys. Diffusion of Bi, Sr, Ba and/or Sb and of Si into basic material is prevented.</p> |
