| 摘要 |
PURPOSE:To increase the bonding area of a mounting brazing material thereby to prevent the brazing material from flowing due to heat and a chip from moving by finely dividing a metal pattern of a semiconductor chip placing unit. CONSTITUTION:A printing pattern of W powder is adhered to a chip placing unit of the recess 6 of a ceramic package substrate 2, Ni, Au are then formed by electroless plating to form a metal layer pattern. When one side of a finely divided metal layer is set to 0.1-0.5mm, its mounting wettability is maintained to provide the effect of gas evacuation. The thickness is preferably set to approx. 0.01-0.1mm. |
