| 摘要 |
PURPOSE:To prevent the excessive melting of thin-films formed onto each member stably by shaping solder projections to the thin-films and preferentially heating only the noses of the projections when the each solder projection is contacted. CONSTITUTION:The solder projections 3a, 3b are formed previously to each of the first and second members to be joined 1a, 1b through the conductive thin- films 2a, 2b for shaping the projections. The solder projections 3a, 3b are contacted and reflowing-bonded, but respective solder projection 3a, 3b is heated so that the temperature of the nose sections is higher than the base sections and joined at that time. The heating method is that microwaves 5 are irradiated under a condition that there are comparatively much flux 4 at the contacting sections of several solder projection 3a, 3b. Accordingly, the flux 4 is heated preferentially because the dielectric loss to the microwaves 5 of the first and second members to be joined 1a, 1b, the thin-films 2a, 2b and the solder projections 3a, 3b is higher than that of the flux 4. |
