| 摘要 |
PURPOSE:To prevent in advance an accident caused by a photoresist during the step of manufacturing semiconductor by removing the photoresist introduced from the outer edge of a semiconductor substrate to the inside in the prescribed width. CONSTITUTION:A light shielding plate 3 for preventing the exposure of a light source lamp 1 in the width of 1-5mm. from the outer edge of the main surface of a semiconductor substrate 7 is mounted at the adequate position in the exposure device used by a photoetching method, and a photoresist 6 is removed. In this manner, an accident of disturbing the free drop of the photoresist due to its adhesive or adhering to the main surface of a semiconductor substrate can be prevented in the step of isolating and scattering the photoresist pattern in the vicinity of the end of the substrate. |
