| 摘要 |
<p>PURPOSE:To obtain semiconductor pellets having the favorable external appearance and having stable characteristic by a method wherein a flexible protective material is filled up between the pellets arranged in order at the prescribed interval, and the protective material is cut after it is cooled to be hardened. CONSTITUTION:A nozzle 13 is arranged in front of a cutter 12 being made to face to the rubber material 3, cooling gas 14 of N2, etc., is made to be blasted off to cool the rubber material speedily, and the rubber material is cut with the cutter 12. Rubber loses flexibility and adhesion, and positioning of the wafer is ensured, the wafer does not move, the rubber material is not adhered to the cutter, and cutting is facilitated. Moreover when tension is applied to a sheet 10 in the direction shown with arrow marks, rubber can be cut easily by shallow cutting with the cutter 12 as to split off by itself. By this constitution, because the rubber material is cut after it is hardened, the rubber material does not curve when cutting is to be performed, a crack or peeling off is not generated, and the wafer can be cut to be divided into the pellets having the favorable exteranl appearance and having stable characteristic.</p> |
