| 摘要 |
Thermosetting resin compsn. contained epoxy resin, polyisocyanate, and reaction products from isocyanate and butadiene copolymer H2N-≮-(CH2-CH=CH=CH2-)a-(-CH(R)-CH2)b-≉n-NH2 or H2N-≮-(CH2-CH=CH-CH2-)a-(-CH2-CH(R)b-≉n-NH2 (R = H, alkyl, alkenyl, nitrilo, phenyl; a>=0.7, b<=0.3, a+b=1, n is suitable integer for the MW of butadiene polymer to be 500-5000). For example, brominated diglycidylether of bisphenol A, HO-terminated acrylonitrile-butadiene copolymer, and sodium ethylate were heated at 120-150≦̸C for 5hr, which were heated with diglycidylether of bisphenol A (epoxy equiv. 174), diphenylmethanediisocyanate, N-methylmorpholine, and movolak-type epoxy resin to give a thermosetting compn.
|
