| 摘要 |
<p>An insulating mounting for a semiconductor component (1) on a cooled support (2), consists of a TGFE layer (3) or an insulating lacquer layer, esp. silicone polyester lacquer layer (3), between the semiconductor component and the cooled support. Pref. PTFE layer is approx. 0.05 mm thick. The arrangement is suitable for the moulding of transistors, thyristors, diodes etc. This intermediate coating provides good electrical insulation, good thermal contact, and mechanical strength or toughness.</p> |
