| 摘要 |
A plating barrel having a number of plating electrodes coupled to a constant source of electrical potential outside the barrel and connected to a metal plate which rotates with the barrel. A spring biases a non-rotating conductor against the plate inside the barrel to provide a low resistance path to the constant source outside the barrel. A number of seals prevent plating solution from reaching the contact between plate and conductor to avoid corrosion and/or plating of the contact area.
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