| 摘要 |
Provided are a chip electronic component which can improve electric properties, thermal impact reliability, etc. by sufficiently securing bonding force between an inner coil area and an external electrode, and a method for effectively manufacturing the same. An aspect of the present invention comprises: a magnetic material main body; and a coil pattern unit embedded inside the magnetic material main body, and including a spiral inner coil unit and a lead-out unit which is connected to an end part of the inner coil unit and is exposed to the outside of the magnetic material main body. The lead-out unit includes a plurality of protrusions separated from each other by being connected to the end part of the inner coil unit, and protruded toward the outside from the end part of the inner coil unit. |
