| 摘要 |
The present invention relates to a device for manufacturing a flexible printed circuit board and the flexible printed circuit board and, more specifically, to a device for manufacturing a flexible printed circuit board, wherein a plasma deposition apparatus is arranged on upper and lower portions of a via hole to perform a plasma deposition process on the upper and lower portions, when the flexible printed circuit board is deposited, so that the device is configured to be compact, manufacturing process speed is enhanced, and a seed layer or a metal layer may be uniformly formed in the via hole. |
