| 摘要 |
PURPOSE:To simplify production processes and yet enhance durability and make obtaining of smoothness on electrode surface easy by using the laminate plate of a specific 4-layer structure as a segment array type electrode material for electrostatic recording and electrically connecting this with through-hole plating. CONSTITUTION:A synthetic resin plate 3 laminated with a copper plate 2 is bonded to the plate 13 side of a Ni plate 12 clad with a copper plate 13, whereby a 4-layer laminate plate is formed. Next, mutually opposing electrode patterns are formed to the plates 12, 13, 2 by etching, and at the same time the plate 2 on the face to be bonded with an electrode holding base 6 and near the same is revomed. Thereafter, through-holes 14 are opened in the respective electrode patterns and through-hole plating 4 is applied to the holes 14, whereby the plates 13, 2 are elecrically connected. The 4-layer laminate plate is cut and the holding base 6 is secured to each cut piece. Next, the surface of the plate 12 is shaped and smoothed, and leads are connected to the segmented plates 2. |
