| 摘要 |
<p>PURPOSE:To surely execute a high-accuracy connection without a strain and an exfoliation by a method wherein a tongue piece, including a bonding part, both ends of which have been erected nearly perpendicularly to the side of a lead frame main body is provided and the tongue piece is fitted and connected to one part of an inner lead. CONSTITUTION:The following are formed: a first conductive plate 2 as a grounding plate; and a second conductive plate 4, as a power plate, which is connected to a power-supply line. A stamping operation to form tongue pieces 10 is executed to the conductive plates 2, 4; a polyimide film is formed on their surface; the tip position of each tongue piece 10 is bent perpendicularly from both sides; erected pieces 10S are formed. A semiconductor chip is fixed to the center of the conductive plate 2 via an adhesive; the conductive plates 2, 4 and a lead frame main body 5 are piled up sequentially. The pieces 10S are fitted to parts a little toward outer leads from the center of inner leads of the main body 5; they are fixed and bonded collectively. After that, a wire bonding operation is executed; a resin sealing operation is executed; a device is completed.</p> |
