| 摘要 |
PROBLEM TO BE SOLVED: To make adhesive properties of a connection electrode with an outer circuit to be large, to improve wire-bonding property, to correspondingly improve manufacture yield and to reduce the manufacture cost. SOLUTION: One conductive semiconductor layer 2 and an inverted conductive semiconductor layer 3 are sequentially laminated on a single-crystal substrate at every light-emitting element. One conductive semiconductor layer 2 is pulled out and an extension part 8 is installed. An insulating film 7, constituted of a polyimide film, is applied on one conductive semiconductor layer 2 and a common electrode 5 is connected to the exposure part. The insulating film 7 is formed to the non-semiconductor coating face of the single crystal substrate 1. The insulating film 7 is also applied to the inverted conductive semiconductor layer 3 and an individual electrode 4 is connected to the exposure part. The individual electrode 4 and the common electrode 5 are extended through the insulating film 7, and the end parts are made to be outer connection electrodes 6 being connection electrodes with the outer circuit. The outer connection electrodes 6 are arranged in silicon oxidized layer 9 on the single-crystal substrate 1. |
