Method of fabricating electronic device employing a flat flexible circuit and including the device itself

摘要

A method of fabricating an electronic device (80), along with the product of that method is disclosed. A flat flexible dielectric substrate (68) is provided with a generally round hole (72) of a given diameter and with a ductile conductive film (70) on the substrate in an area at least about the hole. A generally round terminal pin (74) is provided with a given diameter greater than that of the hole. The difference between the diameter of the pin (74) and the diameter of the hole (72) is on the order of 5% to 50% of the diameter of the hole. At least a portion of the pin (74) is coated with a non-conductive adhesive (82). The pin (74) is inserted into the hole (72) in the substrate (68) such that the non-conductive adhesive (82) is scraped longitudinally from the pin to an area about the hole and the pin, leaving the pin (74) in contact with the conductive film (70).