| 摘要 |
PROBLEM TO BE SOLVED: To provide a shape working device for a lead frame wherein the adjustment region in depress amount of a semiconductor element mounting part is enlarged for easy adjustment of it. SOLUTION: The work device comprises lower molds (inside part 41 and outside part 43) where a recessed part 32 for forming a step through an inclined shape at the lower surface of a lead frame is formed, an upper mold 34 where a protruding part 36 for forming a step through an inclined shape on the upper surface of the lead frame by pressurizing a part of it present on the lower mold 41 after falling is formed, and a presser part 38 which is arranged around the upper mold 34 and presses a part outside a semiconductor element mounting part 18 of the lead frame. The lower mold is divided into a profile of an inside surface 38a of the presser part 38, an outside part 43 comprising a profile agreed with its inside surface 43a, and an inside part 41 arranged while adjacent further inside, with the outside part 43 and inside part 41 allowed to vertically move relative to each other. |
