| 摘要 |
PROBLEM TO BE SOLVED: To enable the reduction of costs for manufacturing, the high density of wiring and the reduction of the thickness of a tape carrier by simplifying processes for forming holes for via holes and conduction processing between conductive multi-layers. SOLUTION: To a tape material having at least three conductive layers, the holes for the via holes to an inner conductive layer through an insulating layer from the outer conductive are formed simultaneously respectively from both front and rear surfaces of the tape material. On the inner peripheral surface and the bottom surface of each of the holes, conductive platings for electrically connecting the outer and inner conductive layers with each other are performed simultaneously respectively from both the front and rear surfaces of the tape material. COPYRIGHT: (C)2005,JPO&NCIPI
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