ELECTRONIC PARTS MOUNTING METHOD AND DEVICE THEREFOR

摘要

A bump (3) is aligned with a substrate electrode (5) in an insulating resin with an anisotropic conductive layer (10) containing conductive particles (10a) and inorganic fillers (6f) interposed therebetween, and a head (8) presses a chip (1) against a substrate (4) at a pressing force of at least 20 gf per bump to correct the warps of the chip and the substrate and join the chip and the substrate together while the bump is crushed and the insulating resin is hardened.