发明名称 |
CICUIT BOARD, METHOD FOR MANUFACTURING SAME, AND HIGH-OUTPUTMODULE |
摘要 |
A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon. <IMAGE> |
申请公布号 |
CA2391218(A1) |
申请公布日期 |
2003.01.05 |
申请号 |
CA20022391218 |
申请日期 |
2002.06.25 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YORITA, JUN;TATOH, NOBUYOSHI |
分类号 |
H05K1/09;H01L21/48;H01L23/12;H01L23/15;H01L23/498;H05K1/03;H05K1/16;H05K3/06;H05K3/10;H05K3/24;H05K3/38 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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