发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD BY USING THIS COMPOSITION AND MANUFACTURE OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain sufficient resolution, sensitivity and aspect ratio of the photosensitive resin composition by incorporating an acid-decomposable substance having a urea group or aminopyrazine group or a radiation-sensitive substance, which prevent the dissolution of a polymer having carboxyl groups in an alkaline developing solution. SOLUTION: The photosensitive resin composition contains the polymer having an alicyclic structure and carboxylic groups, a substance to be allowed to release an acid by radiation and a substance represented by formula I or/and a substance represented by formula II, and in formulae I and II, A1 is an atom of group VI of the periodic table; each of R1 and R2 is a 3-50C organic group and at least one of them is a hydroxyl group to be deprotected with an acid or/and a carboxyl group; A2 is an O, S, or N atom; and each of R3 and R4 is a 3-40C organic group and at least one of them is a hydroxyl group to be deprotected with an acid; or/and a carboxyl group. This makes the obtained pattern forming method superior in resolution performance and free from swelling.
申请公布号 JPH11102065(A) 申请公布日期 1999.04.13
申请号 JP19970263278 申请日期 1997.09.29
申请人 HITACHI LTD 发明人 MAEKAWA YASUNARI;MIWA TAKAO;UENO TAKUMI;OKABE YOSHIAKI
分类号 G03F7/004;G03F7/039;H01L21/027;H01L21/312;(IPC1-7):G03F7/004 主分类号 G03F7/004
代理机构 代理人
主权项
地址