The invention relates to a module with a number electrical or electronic components or switching circuits provided on a common cooler structure flowed through by a cooling medium. The entire cooler structure is comprised of at least to plate-shaped coolers, which are arranged parallel to one another in an interspaced manner and which are flowed through by the cooling medium.
申请公布号
WO2007041977(A2)
申请公布日期
2007.04.19
申请号
WO2006DE01284
申请日期
2006.07.26
申请人
CURAMIK ELECTRONICS GMBH;SCHULZ-HARDER, JUERGEN;MEYER, ANDREAS