Polishing apparatus

摘要

A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.

主权项

1. A polishing apparatus, comprising:
a chuck configured to support a wafer while exposing a peripheral portion of the wafer; a polishing head configured to polish the peripheral portion of the wafer; and a polishing solution supplying assembly above the chuck, the polishing solution supplying assembly configured to spray a polishing solution on the wafer in a liquid curtain form, wherein the polishing solution supplying assembly includes,
a nozzle supporting block having an internal groove, the internal groove connected to a polishing solution supplying line through which the polishing solution is supplied,a nozzle block coupled to the internal groove of the nozzle supporting block, the nozzle block including a distributing plate configured to distribute the polishing solution; anda slit nozzle positioned between the nozzle supporting block and the nozzle block, the slit nozzle configured to spray the polishing solution, and whereinthe internal groove of the nozzle supporting block includes an inclined groove, andthe slit nozzle is provided along a surface of the inclined groove.