发明名称 |
METHOD FOR PERMANENT BONDING OF WAFERS BY SOLID STATE DIFFUSION OR PHASE TRANSITION USING A FUNCTIONAL LAYER |
摘要 |
A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused. |
申请公布号 |
EP3043378(A3) |
申请公布日期 |
2016.10.19 |
申请号 |
EP20150201506 |
申请日期 |
2011.08.30 |
申请人 |
EV GROUP E. THALLNER GMBH |
发明人 |
MARTINSCHITZ, KLAUS;WIMPLINGER, MARKUS;REBHAN, BERNHARD;HINGERL, KURT |
分类号 |
H01L21/60;B23K20/02;B23K20/233;H01L23/488 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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