发明名称 |
ADHESIVE COMPOSITION HAVING IMPROVED ADHESIVE FORCE FOR USE AS INSULATOR |
摘要 |
Disclosed herein is an adhesive composition for an insulator, the adhesive composition including a copolymer formed by using at least one type of phenol-based monomer; at least one type of monomer that is polymerizable by an alkali salt; and at least one type of monomer that is polymerizable by a bisulfate. |
申请公布号 |
US2016319167(A1) |
申请公布日期 |
2016.11.03 |
申请号 |
US201415103311 |
申请日期 |
2014.10.28 |
申请人 |
LG Hausys, Ltd. |
发明人 |
KIM Ji-Mun;LEE Eung-Kee;CHOI Chul-June;KIM Myeong-Hee;JI Seung-Wook;JEON Byung-Joo |
分类号 |
C09J129/02;C09J4/00 |
主分类号 |
C09J129/02 |
代理机构 |
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代理人 |
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主权项 |
1. An adhesive composition for an insulator, wherein the adhesive composition comprises a copolymer that is formed of:
at least one type of one phenol-based monomer; at least one type of one monomer that is polymerizable by an alkali salt; and at least one type of one monomer that is polymerizable by a bisulfate. |
地址 |
Seoul KE |