发明名称 |
LARGE FOOTPRINT, HIGH POWER DENSITY THERMOELECTRIC MODULES FOR HIGH TEMPERATURE APPLICATIONS |
摘要 |
Kilo Watt-level, large footprint, high power density thermoelectric modules are disclosed for high temperature applications. The thermoelectric modules utilize a compliant interface that reduces thermal mismatch stress and allows thermoelectric devices to be fabricated with dimensions greater than 6x6 cm. |
申请公布号 |
WO2016134285(A1) |
申请公布日期 |
2016.08.25 |
申请号 |
WO2016US18717 |
申请日期 |
2016.02.19 |
申请人 |
NOVUS ENERGY TECHNOLOGIES, INC. |
发明人 |
THOMAS, Peter, McLean;VENKATASUBRAMANIAN, Rama |
分类号 |
H01L35/32;H01L35/12;H01L35/16;H01L35/18 |
主分类号 |
H01L35/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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