发明名称 |
Wire bonding apparatus and wire bonding method |
摘要 |
Provided is a wire bonding apparatus including: a wire cutting unit configured to cut a wire by bonding the wire using a capillary and then moving the capillary and a first clamper upward while the first clamper remains closed; and a wire extending unit configured to extend a tail wire from a tip end of the capillary by moving the capillary upward and then moving the capillary and the first clamper upward in a state in which the first clamper is opened and a second clamper is closed. The wire bonding apparatus having such a structure effectively prevents the wire from falling out and bending.
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申请公布号 |
US8191759(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US201113177749 |
申请日期 |
2011.07.07 |
申请人 |
TEI SHINSUKE;TOYAMA TOSHIHIKO;SHINKAWA LTD. |
发明人 |
TEI SHINSUKE;TOYAMA TOSHIHIKO |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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