摘要 |
<p>The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom. In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.</p> |
申请人 |
NIPPON KAYAKU K.K., TOKIO/TOKYO, JP;TAIYO INK MFG. CO. LTD., TOKIO/TOKYO, JP |
发明人 |
KAKINUMA, MASAHISA, OSATO-GUN, SAITAMA-KEN, JP;KOMORI, SHIGERU, KONOSU-SHI, SAITAMA-KEN, JP;YOSHIDA, KAZUHIRO, HIKI-GUN, SAITAMA-KEN, JP;YOKOSHIMA, MINORU, IBARAKI-KEN, JP;OHKUBO, TETSUO, UBE-SHI, YAMAGUCHI-KEN, JP;SASAHARA, KAZUNORI, YAMAGUCHI-KEN, JP |