发明名称 Resiststintenzusammensetzung und daraus hergestelter gehärteter Gegenstand
摘要 <p>The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom. In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.</p>
申请公布号 DE69413116(D1) 申请公布日期 1998.10.15
申请号 DE1994613116 申请日期 1994.05.04
申请人 NIPPON KAYAKU K.K., TOKIO/TOKYO, JP;TAIYO INK MFG. CO. LTD., TOKIO/TOKYO, JP 发明人 KAKINUMA, MASAHISA, OSATO-GUN, SAITAMA-KEN, JP;KOMORI, SHIGERU, KONOSU-SHI, SAITAMA-KEN, JP;YOSHIDA, KAZUHIRO, HIKI-GUN, SAITAMA-KEN, JP;YOKOSHIMA, MINORU, IBARAKI-KEN, JP;OHKUBO, TETSUO, UBE-SHI, YAMAGUCHI-KEN, JP;SASAHARA, KAZUNORI, YAMAGUCHI-KEN, JP
分类号 C08F299/02;C08F290/00;C08G59/16;C08G59/62;C09D11/00;C09D11/033;C09D11/10;C09D11/101;C09D11/103;C09D11/106;G03F7/004;G03F7/027;G03F7/028;G03F7/032;G03F7/038;G03F7/20;H01L21/027;H01L21/30;H01L21/312;H05K3/00;H05K3/18;H05K3/28;(IPC1-7):G03F7/038 主分类号 C08F299/02
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