发明名称 HV-LED MODULE HAVING 3D LIGHT-EMITTING STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.
申请公布号 US2016276402(A1) 申请公布日期 2016.09.22
申请号 US201615073656 申请日期 2016.03.18
申请人 Xiamen Changelight Co., Ltd. 发明人 Lin Zhiwei;Chen Kaixuan;Zhang Yong;Zhuo Xiangjing;Jiang Wei;Fang Tianzu;Zhang Yinqiao;Wang Xiangwu
分类号 H01L27/15;H01L33/42;H01L33/30;H01L33/00;H01L33/32 主分类号 H01L27/15
代理机构 代理人
主权项 1. An HV-LED module having a 3D light-emitting structure, being characterized in comprising at least two stacked parts of substage LEDs that are staggered and bonded to each other, wherein one of the parts defined as a lower part includes n+1 substage LEDs that are coplanar, and the other part defined as an upper part includes n substage LEDs that are coplanar, so that the adjacent substage LEDs in the lower part and in the upper part are located in different planes, in which each said substage LED has an independent light-emitting structure and all of the substage LEDs are connected in series; each said substage LED having an independent, epitaxial light-emitting structure, each two said adjacent independent, epitaxial light-emitting structures being separated by an epitaxial insulating layer; the epitaxial light-emitting structure including an active layer that has a first contact surface on which a first-type electric-conducting layer is provided, and has a second contact surface on which a second-type electric-conducting layer is provided; each said substage LED in the lower part having a substrate on which the first-type electric-conducting layer is provided, a 1st electrode being provided on the first-type electric-conducting layer, a 2nd current-spreading electric-conducting layer being provided on the second-type electric-conducting layer, and a 2nd electrode being provided on the 2nd current-spreading electric-conducting layer, wherein the 1st electrode and the 2nd electrode are at an identical side; each said substage LED in the upper part having the first-type electric-conducting layer provided with a 1st electrode, a 2nd current-spreading electric-conducting layer being provided on the second-type electric-conducting layer, and a 2nd electrode being provide on the 2nd current-spreading electric-conducting layer, wherein the 1st electrode and the 2nd electrode are at an identical side; a non-conductive bonding layer being provided between adjacent contact surfaces of each said substage LED in the upper part and of each said substage LED in the lower part; the 1st electrode of the 1st substage LED in the lower part and the 2nd electrode of the 1st substage LED in the upper part being conductively connected to each other; the 1st electrode of the 1st substage LED in the upper part and the 2nd electrode of the 2nd substage LED in the lower part being conductively connected to each other; the 1st electrode of the 2nd substage LED in the lower part and the 2nd electrode of the 2nd substage LED in the upper part being conductively connected to each other; and the remaining substage LEDs being such successively connected till the nth substage LEDs in the upper part and in the lower part; and the 1st electrode of the nth substage LED in the upper part and the 2nd electrode of the n+1th substage LED in the lower part being conductively connected to each other; and the 1st electrode of the n+1th substage LED in the lower part and the 2nd electrode of the 1st substage LED in the lower part acting as soldering-station electrodes.
地址 Xiamen CN