| 摘要 |
PROBLEM TO BE SOLVED: To provide a jointing method which will not generate voids and bonds plate-shaped members uniformly when the two plate-shaped members are jointed temporarily to each other, and enhances the quality of products. SOLUTION: A silicon wafer 10 is bonded to a glass wafer 11 to be temporarily jointed so that a projecting direction of a warpage of the silicon wafer 10 faces the projecting direction of the warpage of the glass wafer 11. COPYRIGHT: (C)2008,JPO&INPIT
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