| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package substrate capable of preventing remaining bubbling of a die-attaching agent and overflow thereof. <P>SOLUTION: A group of first fingers 321, a group of second fingers 322 and a group of third fingers 323 are provided on a surface 311 of a substrate body 310. The group of first fingers 321 are positioned between the groups of second and third fingers 322 and 323. A solder mask layer 330 is formed on the surface 311 and has a first opening 331, a second opening 332 and a third opening 333 exposing the groups of first, second and third fingers 321, 322 and 323, respectively. A first gas discharge groove portion 340 is formed on the exposed surface of the solder mask layer 330, does not extend through the solder mask layer 330, is connected to the first opening 331 and extends to sides 313, 314 of the surface 311, and does not couple together with the second opening 332 and the third opening 333. In this manner, since the semiconductor package has a passage for discharging a gas to the outside, retention of the bubbles of the die-attaching agent are prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT |
